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PCB Manufacture Capability
| Item | Manufacture Capability | Details |
| Layer | 1-16 layers 32 layers | 1-16 layers PCB prototypes 1-32 layers Custom PCBs |
| Material | FR-4 | FR-4 Base material,Rogers.High Tg;HDI(Rogers、Arlon、Taconic); |
| Minimum.Dimension | 5*5mm | Minimum.Dimension is 5*5mm |
| Max. Dimension | 500x1100mm | Maximum dimension is 500x1100mm |
| Dimension Tolerance (Outline) | ±0.2mm | ±0.2mm for CNC routing, and ±0.2mm for V-scoring |
| Thickness | 0.4–2.4mm | 0.4/0.6/0.8/1.0/1.2/1.6/2.4mm |
| Thickness Tolerance ( T≥1.0mm) | ± 10% | e.g. For the 1.6mm board thickness, the finished board thickness ranges from 1.44mm（T－1.6×10%）to 1.76mm（T＋1.6×10%) |
| Thickness Tolerance ( T<1.0mm) | ± 0.1mm | e.g. For the 0.8mm board thickness, the finished board thickness ranges from 0.7mm（T-0.1）to 0.9mm（T+0.1). |
| Min. Trace | 4mil | Minimum trace width is 4 mil. 6mil is recommended for cost savings |
| Min. Spacing | 4mil | Minimum spacing is 6 mil. 6mil is recommended for cost savings |
| Finished Outlayer Copper | 1oz/2oz/3oz/4oz(35μm/70μm/105μm) | 35μm=1oz, 70μm=2oz, 105μm=3oz.140μm=4oz |
| Finished Innerlayer Copper | 0.5 oz/1oz (17μm/35μm) | Finished innerlayer copper weight is 0.5oz/1oz. |
| Drill Hole Size | 0.2–6.3mm | Min. drill size is 0.2mm, Max. drill size is 6.3mm,Any holes are beyond 6.3mm would be extra charged |
| Annular Ring | ≥6mil | Annular ring surrounded by traces should be ≥ 6mil(0.153mm) |
| Hole Size Tolerance | ±0.08mm | e.g. For the 0.6mm hole, the finished hole size between 0.52mm to 0.68mm is acceptable. |
| Solder Mask | LPI | Liquid Photo-Imageable Solder Mask is the most common mask type. |
| Min. Character Width | ≥4mil | Characters width less than 4mil(0.1016mm) will be unidentifiable. |
| Min. Character Height | ≥1mm | Characters height less than 1mm will be unidentifiable. |
| Trace to Outline | ≥0.3mm | Rounting: Trace to Outline≥0.3mm; V-scoring: Trace to V-cut line≥0.4mm |
| Panelization without space | 0mm | For V-scoring panelization, set the space between boards to be 0mm |
| Panelization with space | 2mm | For Rounting panelization,set the space between boards to be ≥2mm. |
| Copper Hatching with Pads | Hatch | We will apply Copper Hatching if your PCBs designed with Pads. |
| Slot Drawing with Pads | Outline | Please use Outline to design if there are many non-plated (NPTH) holes. |
| Protel/dxp Solder Layer | Solder Layer | Do not mistake the Paste Layer as Solder Layer. |
| Protel/dxp Outline Layer | Keepout Layer/Mechanical Layer | Keepout Layer or Mechanical Layer as outline. |
| Min. Half Hole Diameter | 0.6mm | half hole diameter should be ≥ 0.6mm. |
| Soldermask Bridge | 0.1mm | Solderbridge is not available now |
| Surface Finishing | HASL with lead,HASL lead Free, Immersion gold (ENIG),OSP,hard gold | Other special surface finish,please send your requirement to cpd@currentronics.com |
| Solder Mask | Green ,Red, Yellow, Blue, White ,Black | No extra charge (Green, Red, Yellow, Blue) |
| Silkscreen | White, Black, None | |
| Panelization | V-scoring, | Leave min clearance of 1.6mm between boards for break-routing. For V-score panelization, set the space between boards to be zero. |
| Tab-routing, | ||
| Tab-routing with Perforation (Stamp Holes) |
Our Flexible Manufacture Capability (FPC)
| Item | Normal Flexible board and Rigid-Flex board | Special |
| NO.OF Layer | 1-8Layers | 10 Layers |
| Finished board dimension (Max) | 250*650mm | 250*1000mm |
| Finished board dimension (Min) | 10mm*10mm | 5mm*5mm |
| Board thickness (Max) | single sided board 6.4Mil (0.160mm) | single sided board 7.8Mil (0.195mm) |
| Double sided flexible board 10.2mil (0.55mm) | Multilayer flexible board 14 Mil(0.35mm) | |
| Double sided flexible board 22mil (0.55mm) | Multilayer flexible board 24.6 Mil(0.615mm) | |
| Rigid-Flex 64mil (1.6mm) | Rigid-Flex 128Mil (3.2mm) | |
| Soft board thickness( Min) | single sided board 3Mil (0.075mm) | single sided board 1Mil (0.04mm) |
| Double sided flexible board 4mil (0.1mm) | Double sided flexible board 3mil (0.075mm) | |
| Multilayer flexible board 7.2mil (0.18mm) | Multilayer flexible board 6mil (0.15mm) | |
| Rigid-Flex 10mil (0.25mm) | Rigid-Flex 8.8Mil (0.22mm) | |
| Finished board thickness tolerance | Double sided flexible board ±1.2mil （+/-0.03mm） | Double sided flexible board±0.8mil （+/-0.02mm） |
| Double sided flexible board ±2mil （+/-0.05mm） | Double sided flexible board ±1.6mil （+/-0.04mm） | |
| Rigid-Flex ±10% | Rigid-Flex ±8% | |
| Drill hole diameter (min) | 6mil (0.15mm) | 4mil (0.10mm) |
| Outline | ±4mil (+/-0.1mm) | ±/2mil (±0.05mm) |
| Outer layer base copper thickness (min) | 1/4oz (9um) | 1/5 oz (6um) |
| Outer layer base copper thickness (max) | 2oz (70um) | 3 oz( 105um) |
| Inner Layer Dielectric thickness (Min) | 0.0125mm (1/2mil) | 0.0125mm (1/2mil) |
| Inner Layer Dielectric thickness (Max) | 0.05mm( 2mil) | 0.05mm (2mil) |
| Base material | PI/PET | SPET |
| Hole plating aspect ratio (Max) | 6:01 | 8:01 |
| Hole diameter tolerance (PTH) | ±3mil(±0.076mm) | ±3mil(±0.076mm) |
| Hole diameter tolerance (NPTH) | ±2mil(±0.050mm) | ±2mil(±0.050mm) |
| Hole position tolerance (compared with CAD data) | ±3mil(±0.076mm) | ±0.05mm |
| Hole diameter tolerance (NPTH) | ±2mil(±0.050mm) | ±2mil(±0.050mm) |
| Hole position tolerance (compared with CAD data) | ±3mil(±0.076mm) | ±0.050mm |
| PTH Hole Copper Thickness | Double sided flexible board ≥0.3-0.98mil(8-25um) | |
| Multilayer flexible board ≥0.47-1.4mil(12-35um) | ||
| Rigid-Flex ≥0.70-1.4mil(12-35um) | ||
| Laver design line width/spacing (min) | single sided flex board 2/2mil (0.05/0.05mm) | single sided flex board 1.6/1.6(0.04/0.04mm) |
| Double sided Flex board 2/2mil (0.05/0/05mm) | Double sided Flex board1.8/1.8mil (0.045/0.045mm) | |
| Multilayer Flex board 3/3mil (0.075/0.075mm) | Multilayer Flex board 2.4/2.4mil (0.06/0.06mm) | |
| Rigid-Flex 4/4mil (0.1/0.1mm) | Rigid-Flex 3/3mil (0.075/0/075mm) | |
| Mini solder and bonded pads | 8mil(0.2mm) | 6mil(0.15mm) |
| Tolerance design line width/spacing (min) | ±20% | ±15% |
| Image to Image tolerance (Min) | ±3mil(±0.075mm) | ±2mil(0.05mm) |
| Image to Image tolerance (Min) | ±4mil(±0.1mm) | ±3mil(±0.075mm) |
| Mini pad for multilayer boards | 20mil(0.5mm) | 16mil(0.4mm) |
| legend mask registration (min) | ±12mil(±0.3mm) | ±6mil(±0.15mm) |
| Soldermask registration (min) | ±3mil(±0.075mm) | ±2mil(±0.05mm) |
| Soldermask thickness (min) | ±4mil(10um) | ±4mil(10um) |
| CVL registration | ±12mil(±0.3mm) | ±8mil(±0.2mm) |
| CVL (min) | 2mil-6mil (0.05-0.15mm) | 2mil-6mil (0.05-0.15mm) |
| Plating (Gold finger nickel thickness) | 120-400u〞(3-10um) | 120-400u〞(3-10um) |
| Gold finger nickel thickness | 0.4-4u〞(0.01-0.09um) | 0.4u〞-120u〞(1-3um) |
| Nickel thickness for electroless nickel and immersion gold (measlred at the minmum point) Max | 40-240u〞(0.4-2u〞) (1-6um/0.01-0.05um) | 40-320u〞(0.4-3u〞) (1-8um/0.01-0.075um) |
| The tolerance of pasteing adhesive and stiffer) | ±12mil(±0.3um) | ±6mil(±0.15um) |
| Impedance tolerance (min) | ±10% | ±8% |